金屬導熱基板/軟板/硬板電路板專業製造商
Process Capability
| Items | IMPCBInsulation Metal PCB (IMPCB) | Flexible Printed Circuit Board (FPCB) | Printed Circuit Board (PCB) |
| Type | Single Side/ Double Side/ Multi-Layer | Single side / Double Side / Multi-Layer/Rigid- Flex Board | Single Side/ Double Side/ Multi-Layer/un-through hole board |
| Base | 鋁、銅之金屬基材 | 2-Layer or 3-Layer等之PI材 | FR4、FR5等玻纖材 |
| thickness=0.1mm(min) | thickness=0.1~6.0mm | ||
| tolerances:±0.05mm(min) | tolerances:±0.1mm(min) | ||
| Working panel | 510X610mm(max) | 250X500mm(max) | 510X610mm(max) |
| Tarce Width/Space | trace/space=4/4mil(min) | trace/space=4/4mil(min) | trace/space=4/4mil(min) |
| Dielectric layer | High Thermal Conductivity Type ，T=4mil(min) | T=1mil(min) | P.P，T=2mil(min) |
| Copper Cladding Thickness | 1oz~10oz | 0.5oz~2oz | 0.5oz~10oz |
| Plated Through Hole(PTH) | 0.15mm(min) | 0.15mm(min) | 0.15mm(min)，Vias in PAD |
| Electrodeposition /PTH | 1000u” (min) | 400u” (min) | 800u” (min) |
| trace/space=4/4mil(min) | trace/space=4/4mil(min)trace/space | trace/space=4/4mil(min) | |
| Solder mask | thickness:0.7~1.5mil | thickness:0.4~0.7mil(or coverlay) | thickness:0.7~1.5mil |
| 隔焊下墨間距4mil(min) | 隔焊下墨間距4mil(min) (SLOT：40mil ) | 隔焊下墨間距4mil(min) | |
| Silkscreen | 下墨線寬5mil(min) | 下墨線寬5mil(min) | 下墨線寬5mil(min) |
| Circuit layer finished | HASL; immersion/Electroplating silver,Tin, gold; OSP; Anodization | HASL; immersion/Electroplating silver,Tin, gold; OSP | HASL; immersion/Electroplating silver,Tin, gold; OSP |
| 鋁面陽極處理 | |||
| Alignment (NPTH) | 1.0~6.5mm | 0.2~6.5mm | 0.2~6.5mm |
| Mechnical technics | flare,dish down,un-through hole | Rigid- Flex Board un-through hole |
NA |
| Outline configuration Process | CNC, punch, V-cut | punch(steel tooling ,cutter) | CNC, punch, V-cut |
| Circuit functional test | O/S testing, HI-POT | O/S testing | O/S testing |
| 品檢 | 成品檢驗規範 | 成品檢驗規範 | 成品檢驗規範 |
| 品質認證 | UL 94V-0、ROHS、SGS | UL 94V-0、ROHS、SGS | UL 94V-0、ROHS、SGS |
| 包裝出貨 | 真空氣泡、收縮膜或脆盤(管)包裝 | 夾鍊帶包裝 | 真空氣泡包裝 |
